Job Description

Job Req ID: 27961

About Supermicro:

Supermicro is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are the #5 fastest growing company among the Silicon Valley Top 50 technology firms. Our unprecedented global expansion has provided us with the opportunity to offer a large number of new positions to the technology community. We seek talented, passionate, and committed engineers, technologists, and business leaders to join us.

Job Summary:

We are seeking a highly skilled Staff Data Center 3D Design Engineer to lead 3D mechanical development and digital modeling for high-density, liquid-cooled data center infrastructure. This individual will own the mechanical design, simulation, and documentation for both server rack-level and data hall-level systems. 3D simulation experience is required, and experience in data center-specific CFD and FEA simulation is strongly preferred.

The ideal candidate should have expertise in CAD modeling, CFD/FEA simulations, and liquid cooling system design. Experience with integrating electrical components (power shelves, BBUs, busbars) and knowledge of OCP, ASHRAE, and EIA standards are required. Digital twin development experience is a plus, and strong familiarity with data center systems is necessary.

Essential Duties and Responsibilities:

Essential Duties and Responsibilities:

• Lead mechanical design for 3D assemblies including rack structures, cooling manifolds, tubes, hoses, and connectors.
• Ensure full integration of electrical components such as power shelves, busbars, BBUs, and inverters within 3D designs.
• Design and simulate liquid cooling systems (e.g. CDM) with attention to layout, flow optimization, and material compatibility.
• Develop digital twin models to simulate airflow, thermal behavior, and system interactions across rack and room levels.
• Perform CFD simulations using Cadence (Future Facilities) and similar tools to validate thermal performance.
• Conduct FEA simulations to evaluate structural integrity, mechanical stress under operational loads, and thermal expansion effects due to fluid temperature differentials.
• Document design outputs including detailed 3D models, 2D drawings, BOMs, simulation results, and test documentation.
• Ensure adherence to OCP, ASHRAE, and EIA standards and incorporate into mechanical design practices.
• Coordinate closely with hardware, electrical, and facility teams to ensure successful end-to-end design integration.
• Lead design reviews and support product development cycles through manufacturing, testing, and deployment.

Additional Responsibilities:

• Support prototyping through 3D printing and other fabrication methods.
• Mentor junior mechanical and simulation engineers.
• Contribute to continuous improvement of design templates, simulation workflows, and documentation standards.
• Stay up to date with new industry standards, cooling technologies, and materials science relevant to liquid cooling and high-density infrastructure.
• Participate in vendor evaluation, equipment benchmarking, and component selection.

Qualifications:

Qualifications - Required:

• Bachelor's or Master's degree in Mechanical Engineering or related field.
• Minimum 12 years of experience in mechanical design for data centers or high-performance computing environments.
• Expert-level proficiency with SolidWorks or equivalent 3D CAD tools.
• Experience with CFD simulation using Cadence (Future Facilities) or equivalent tools.
• Strong understanding of FEA principles and application.
• Deep knowledge of liquid cooling systems including CDMs, tubes, connectors, and material compatibility.
• Experience with power infrastructure elements such as BBUs, inverters, power shelves, and busbars.
• Familiarity with OCP, ASHRAE, and EIA standards.
• Excellent communication skills and cross-functional collaboration ability.
• Ability to work independently and lead key aspects of complex technical projects.

Preferred Qualifications:

• Experience developing and managing digital twin environments for mechanical systems.
• Proficiency in 3D printing, prototyping, and thermal testing workflows.
• Prior experience in rack-level thermal optimization or modular cooling design.
• Familiarity with BIM/Revit and integration of 3D mechanical models into facility-level planning.
• Demonstrated success in end-to-end delivery of mechanical designs for hyperscale or AI data centers.

Salary Range

$170,000 -195,000

The salary offered will depend on several factors, including your location, level, education, training, specific skills, years of experience, and comparison to other employees already in this role. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation, such as participation in bonus and equity award programs.

EEO Statement

Supermicro is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of Supermicro to provide equal opportunity to all qualified applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status or special disabled veteran, marital status, pregnancy, genetic information, or any other legally protected status.

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